Wafer Plating – Stratus™ P300
ECD 300 – 200 mm Wafer Processing
Applications
- Configurable for up to 6 metals
- UBM/RDL
- Fan Out
- RF Filters
- Power Devices
Features
- Dual wafer size capability
- Membrane Cells for long bath stability
- ShearPlate™ technology for thinnest boundary layer
- Substrate handling flexibility
Substrates
- 300 and 200 mm wafers
- Silicon, eWLB, Bonded, Carrier
Other Products