Wafer Sputtering – Apollo 300

PVD 200-300 mm Wafer Processing

Applications
  • Configurable for up to 5 metals
  • UBM/RDL
  • Fan Out
  • RF Filters
  • Power Devices
Features
  • True Bridge tool capability: Size Change
  • Degas/Anneal
  • ICP/CCP Etch
Substrates
  • 200 and 300 mm wafers
  • Warped and heavy wafer processing
  • Silicon, EMC, RCP, Glass, Bonded

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